Research on Pad Dressing Process for Chemical Mechanical Polishing of Silicon Wafers
碩士 === 淡江大學 === 機械工程學系 === 89 === With increasing diameter of silicon wafer and tight specification of photolithography process, global flatness of wafer surface is important in Integrated Circuit(IC) manufacturing. Chemical Mechanical Polishing (CMP) is the most popular method to reach global flat...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/11209581351959045549 |