Use Flip Chip Package Technology to Develop Multi-Chip Module of Static Random Access Memory（SRAM）
碩士 === 元智大學 === 化學工程研究所 === 89 === In the future trend, the electronic products are moving to lighter, thinner, shorter and smaller, especially for mobile communication equipment, notebook, handy monitor, mobile medical equipment, space and defense electronic system. Flip chip package technology is...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95893004634232646234 |