高靈敏度壓電阻應力計製程研究與u-BGA構裝應力量測分析
碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 90 === ABSTRACT As die size continuously scales down in modern IC and the circuit density in an IC go higher, thermal and thermal-mechanical problems in modern microelectronic packaging become more and more serious. Thus, powerful tools for stress e...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75101827813874869819 |