Transient Analysis of Heat Transfer, Moisture Diffusion and Hygrothermal interfacial Stresses in Plastic IC Packaging Using Interface Element Method
碩士 === 國立中正大學 === 機械系 === 90 === Plastic packages are faced the delamination problems on the interfaces at each layer of packaging component that lead to degrade the reliability in the thermo-moisture environments. As the result of this, the determination of the interfacial stresses with the moistur...
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| Format: | Others |
| Language: | zh-TW |
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2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56159995274675710482 |