Investigation of Thermosonic Wire Bonding of Electronic Packaging for Chips with Copper Interconnect from the view point of Micro-Interfacial Phenomena
碩士 === 國立中正大學 === 機械系 === 90 === The requirements for improved performance and reduced size have driven Copper to replace Aluminum interconnection for deep submicron integrated circuit. Copper has been identified as the best candidate to replace Aluminum due to its low resistivity, high electromigra...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/43950073494345805669 |