MAP Process-Induced Deformation In Electronic Packages
碩士 === 長庚大學 === 機械工程研究所 === 90 === The process- and thermal-induced deformations (warpage) of thin plastic electronic packages obtained form Matrix Array Package (MAP) process are investigated numerically and experimentally in this study. For numerical analyses, the finite element method...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2002
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Online Access: | http://ndltd.ncl.edu.tw/handle/08510161265562679614 |