MAP Process-Induced Deformation In Electronic Packages
碩士 === 長庚大學 === 機械工程研究所 === 90 === The process- and thermal-induced deformations (warpage) of thin plastic electronic packages obtained form Matrix Array Package (MAP) process are investigated numerically and experimentally in this study. For numerical analyses, the finite element method...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08510161265562679614 |