Ineterfacial Reactions and Microstructural Analysis of the Sn-Zn-Cu System
碩士 === 國立中興大學 === 材料工程學研究所 === 90 === Interfacial reactions and microstructural analysis of the Sn/Zn and Zn (electroplated)/Cu binary systems, and Sn (electroplated)/Zn (electroplated)/Cu, and Sn-9Zn/Cu ternary systems upon heat treatment at 200, 250, and 300℃ for 5 and 30 min in formic...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75308777987758391990 |