A SYUDY ON THE EFFECTS OF FILM STRESS AND POLISHING STRESS ON COPPER CMP
碩士 === 國立中興大學 === 機械工程學系 === 90 === ABSTRACT Chemical mechanical polishing (CMP) is the most commonly used process in the planarization of wafer surfaces. This thesis, from the stress viewpoint, investigates the effects of intrinsic stress and extrinsic stress on the removal rate of coppe...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09214030508594812993 |