A Study of Thermal Stress and Failure Mechanism of Solder Jointsfor Thin and Fine-pitch Ball Grid Array Package
碩士 === 國立成功大學 === 工程科學系專班 === 90 === The major reliability issue of Ball Grid Array package is solder joint crack due to thermal expansion mismatch between joined materials.In this study, a nonlinear finite element mode was used to analyze solder joints under the thermally induced stress and failur...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/y6wxhj |