Heat Transfer Analysis of IC Packaging Molds Using Boundary Element Method
碩士 === 國立成功大學 === 工程科學系專班 === 90 === Epoxy molding compounds (EMCs) have been used widely as encapsulation materials for IC packages, which provide adequate mechanical, electronic and thermal properties to protect IC packages from hazard environment. There are exothermic and reactive polymerizations...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/cgma8j |