A Study on the Adhesion Between EMC and IC Package Mold
碩士 === 國立成功大學 === 工程科學系碩博士班 === 90 === In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. In this project, we will us...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/zb47kz |