A Study on the Adhesion Between EMC and IC Package Mold

• Main Authors: Yen-Juu Ju, 朱言主
• Other Authors: Huei-Huang Lee
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/zb47kz

碩士 === 國立成功大學 === 工程科學系碩博士班 === 90 === In IC packaging, when epoxy molding compound（EMC）is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. In this project, we will use the adhesion tester to measurement adhesion force in the interface between EMC and mold surface. By measuring the adhesion force, we can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. In this project, we also study the IC encapsulation mold adhesion force using Taguchi’s parameter design method. By using Taguchi’s method, we can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface. In IC encapsulation process, some residue substance will adhere to the mold surface after 500 to 600 shots. Using the EMC adhesion force test technology, one can measure the adhesion force between mold surface and EMC continuously. By recording the adhesion force and analyzing the mold surface, we can understand more about what happened and key issues for mold adhesive effects in IC encapsulation process.