Study of Significant Factors to Influence the Au-Al Intermetallic of Ball Bonding in Semiconductors Packaging, and the Improvement Method
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 90 === Intimate contact between Au and Al is very important for forming a good Au-Al intermetallic during thermosonic Au-Al ball bonding in modern IC packaging process. This good intermetallic can provide strong and electrical connection between silicon chip, gold w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/nbza7n |