Modeling of Rapid Thermal Processing for Wafers

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 90 === Abstract In this work, we consider heat transfer in Rapid Thermal Processing (RTP) for the RTP equipment under development in CSIST. Numerical schemes simulating radiative heat exchange among the lamps, chamber and a 300mm wafer and heat conduction in the wafe...

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Bibliographic Details
Main Authors: Chung-Jen Chi, 紀崇仁
Other Authors: C. Y. Wu
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/trty8a