The Thermal Analysis and Optimization for Ball Grid Array Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 90 === With the rapid development of technology, the trend of electronic products getting smaller and multi-functional. Therefore, it is better to design an electronic product with high heat dissipation. In this study, the computational fluid dynamics approach is emp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e3e94k |