The Thermal Analysis and Optimization for Ball Grid Array Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 90 === With the rapid development of technology, the trend of electronic products getting smaller and multi-functional. Therefore, it is better to design an electronic product with high heat dissipation. In this study, the computational fluid dynamics approach is emp...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e3e94k |
| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 90 === With the rapid development of technology, the trend of electronic products getting smaller and multi-functional. Therefore, it is better to design an electronic product with high heat dissipation. In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array (BGA) package that is popular in modern electronic industry. Due to the complicate geometric configuration of BGA, the sub-model approach is used to simulate the temperature distributions of thermal vias and solder balls with maintaining the physics in this study. The effective thermal resistance of BGA package is then obtained from numerical simulations. An artificial neural network is trained to build up the relation between input geometry and output thermal resistance. The well-trained network is then used to couple with a complex optimization method to search the optimal BGA design with lower thermal resistance. The study will provide electronic package industry a reliable and rapid method of the heat dissipation design of BGA package.
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