Realization of piezoelectric driven material testing system and its application in electronic package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 90 === Traditionally, packaging reliability is characterized by thermal-cycling fatigue testing. However, the testing speed is slow. In addition, the coupling between mechanical fatigue loading, the variation of temperature dependent material properties, and time de...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/cb8a9q |