Occurrence of Electromigration at High-Pb/Eutectic Solder Interface
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === The electromigration behavior in high-Pb/eutectic composite solder lines were studied in this experiment. Using Si V-grooves, we simulated the composite solder structure by reflowing the two solders into it. Electromigration effect was studued as a...
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| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32761218891562411095 |