Preparation of Ni/Cu Bumps and Interconnect Using Electroless Plating Technique for Flip Chip Bonding
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === This thesis employed the electroless plating technology, accompanying with the photolithography and etching process, to prepare Ni/Cu double-layered metal bumps for flip chip packaging of high-frequency devices. The electroless plating of Cu is relati...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83366147503736610348 |