Investigation of Copper Electropolishing for Damascene Interconnects in ULSI
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === The purpose of this thesis is to establish Cu electropolishing technology for the back-end multi-layer interconnects, including the production of copper wires by electropolishing process, the planarization of step-height for Cu electroplating layers a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73398810131510747649 |