Hermetic Packaging Technology Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy Layer
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === We develop an easy, low cost, and low temperature optoelectrionic hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. Bonding characteristic of our design is investigated on three different setups: silicon-silicon,...
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| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94496176607047932915 |