Tin Whisker Growth Driven by Electrical Currents
碩士 === 國立交通大學 === 材料科學與工程系 === 90 === Lead-free solders are replacing traditional SnPb solders gradually due to environmental concern in microelectronic packaging industry. In most lead-free solders, tin is the richest element and weighs over 95% of the solders. Therefore, tin whisker g...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01760708462582010613 |