Study on Integration of Ultra Low-K Material
碩士 === 國立交通大學 === 電子工程系 === 90 === Abstract As the feature of the integrated circuit (IC) is scaled down, the resistance and capacitance of multilevel interconnect are increased due to the thinner metal wires and shorter distance between them. The interconnect RC delay and powe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30750261442639936937 |