Research on Key Factors from Pick-up IC Chip Process

碩士 === 國立交通大學 === 機械工程系 === 90 === The pick-up chip process is to pick up the chip from blue tape for semiconductor packaging. Now a day, more compact the electronic systems are used, more thin chip packaging is popular. The relationship among factors of the pick-up chip need to understan...

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Bibliographic Details
Main Authors: Chen-Chung Du, 杜陳忠
Other Authors: Ching-Huan Tseng
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/04695449025139153229