Research on Key Factors from Pick-up IC Chip Process

• Main Authors: Chen-Chung Du, 杜陳忠
• Other Authors: Ching-Huan Tseng
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/04695449025139153229

碩士 === 國立交通大學 === 機械工程系 === 90 === The pick-up chip process is to pick up the chip from blue tape for semiconductor packaging. Now a day, more compact the electronic systems are used, more thin chip packaging is popular. The relationship among factors of the pick-up chip need to understand and to search the key factors of the pick-up process. The factors of the pick-up process can be classified in different materials, tools, operations, and mechanism in generally. The key point in this research is to analyze the process of peeling chip from tape. Then, FEM model of ANSYS is used to build for simulating the pick-up chip process, and analyzing the tendency of these factors. The results for the analysis among these factors are to find the key factors of the pick-up chip process and the direction of the technology for the pick-up chip mechanism.