Research on Key Factors from Pick-up IC Chip Process
碩士 === 國立交通大學 === 機械工程系 === 90 === The pick-up chip process is to pick up the chip from blue tape for semiconductor packaging. Now a day, more compact the electronic systems are used, more thin chip packaging is popular. The relationship among factors of the pick-up chip need to understan...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04695449025139153229 |