Integration of Copper and Porous Low Dielectric Constant Materials
碩士 === 國立交通大學 === 機械工程系 === 90 === As the devices become smaller and dimensions decline to sub-micron scale, the performance of integrated circuits will be significantly limited by the interconnect RC time delay. To alleviate these impacts, copper and low dielectric constant materials are...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/99868972638712822673 |