Experimental and Finite Element Analyses on Wire Bonding
碩士 === 國立交通大學 === 機械工程系 === 90 === Wire bonding is the most popular interconnection method in electronic packaging. The controlled parameters significantly affect the bonding strength when the tiny golden wires(25μm in diameter) are used in this process. This study examines how parameters and bondin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56788170089122720277 |