Scrap Rules Determination for Small Lots in Wafer Fabrication
碩士 === 國立交通大學 === 工業工程與管理學程碩士班 === 90 === In semiconductor manufacturing, a typical wafer lot is composed of 25 wafers. Due to the yield problems, wafers in a lot may decrease in number during manufacturing. Such a lot is called a small wafer lot. The unit cost of manufacturing the wafers...
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ndltd-TW-090NCTU10310052015-10-13T10:08:42Z http://ndltd.ncl.edu.tw/handle/54520390516234126454 Scrap Rules Determination for Small Lots in Wafer Fabrication 晶圓廠小批量之報廢準則研究 Chie-Wun Chiou 邱志文 碩士 國立交通大學 工業工程與管理學程碩士班 90 In semiconductor manufacturing, a typical wafer lot is composed of 25 wafers. Due to the yield problems, wafers in a lot may decrease in number during manufacturing. Such a lot is called a small wafer lot. The unit cost of manufacturing the wafers in a small lot is more expensive than a normal lot. Yet, completing the manufacture of a small lot would create revenue. Semiconductor fab. therefore always have to make the decision─under what conditions should a small wafer lot be scraped. According to our survey, no literature has been published on this research problem. And the decision made in industry is often by the intuition of shop managers. The main objective of this paper aims to develop the decision-making methods for scrapping small lots in semiconductor fab. in order to maximize the profit. We intend to develop genetic algorithm methods under a simplified production scenario. One main assumption is that the bottleneck machine is a particular type. Muh-Cherng Wu 巫木誠 2002 學位論文 ; thesis 86 zh-TW |
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碩士 === 國立交通大學 === 工業工程與管理學程碩士班 === 90 === In semiconductor manufacturing, a typical wafer lot is composed of 25 wafers. Due to the yield problems, wafers in a lot may decrease in number during manufacturing. Such a lot is called a small wafer lot. The unit cost of manufacturing the wafers in a small lot is more expensive than a normal lot. Yet, completing the manufacture of a small lot would create revenue. Semiconductor fab. therefore always have to make the decision─under what conditions should a small wafer lot be scraped. According to our survey, no literature has been published on this research problem. And the decision made in industry is often by the intuition of shop managers. The main objective of this paper aims to develop the decision-making methods for scrapping small lots in semiconductor fab. in order to maximize the profit. We intend to develop genetic algorithm methods under a simplified production scenario. One main assumption is that the bottleneck machine is a particular type.
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author2 |
Muh-Cherng Wu |
author_facet |
Muh-Cherng Wu Chie-Wun Chiou 邱志文 |
author |
Chie-Wun Chiou 邱志文 |
spellingShingle |
Chie-Wun Chiou 邱志文 Scrap Rules Determination for Small Lots in Wafer Fabrication |
author_sort |
Chie-Wun Chiou |
title |
Scrap Rules Determination for Small Lots in Wafer Fabrication |
title_short |
Scrap Rules Determination for Small Lots in Wafer Fabrication |
title_full |
Scrap Rules Determination for Small Lots in Wafer Fabrication |
title_fullStr |
Scrap Rules Determination for Small Lots in Wafer Fabrication |
title_full_unstemmed |
Scrap Rules Determination for Small Lots in Wafer Fabrication |
title_sort |
scrap rules determination for small lots in wafer fabrication |
publishDate |
2002 |
url |
http://ndltd.ncl.edu.tw/handle/54520390516234126454 |
work_keys_str_mv |
AT chiewunchiou scraprulesdeterminationforsmalllotsinwaferfabrication AT qiūzhìwén scraprulesdeterminationforsmalllotsinwaferfabrication AT chiewunchiou jīngyuánchǎngxiǎopīliàngzhībàofèizhǔnzéyánjiū AT qiūzhìwén jīngyuánchǎngxiǎopīliàngzhībàofèizhǔnzéyánjiū |
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