Application of Taguchi Methods to Improve the Ball Grid Array Substrate Process
碩士 === 國立交通大學 === 工業工程與管理學程碩士班 === 90 === In IC packaging of Semi-Conductor industry, BGA substrate has been applied as a packaging material in considerable quantities. The BGA product has a long process cycle time, and the finished goods need to pass the reliability test before shipment. It will im...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99545225930088116805 |