The Study of Pb/Sn and Au/Sn Solder Joints in a Laser Module Package
碩士 === 國立中山大學 === 光電工程研究所 === 90 === Abstract The influence of thermal aging on joint strength and fracture surface of PbSn and AuSn solders in laser module packages has been studied experimentally and numerically. Al2O3-Solder-Substrate assembled samples were aged at 150oC for one, four, nine, si...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41565979917048339126 |