Numerical Simulation on Thermal Fatigue of a Flip Chip Scale Packaging
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 90 === Abstract The thesis is aimed to simulate the flip chip in chip scale package (FCCSP) by finite element method incorporated with software ANSYS due to thermally cyclic loading. The difference between two-dimensional and tree-dimensional structures is con...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96457343714728933908 |