The Study of the Moisture Effect on the Interfacial adhesion of IC Packages in the IR-Reflow Process
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 90 === Abstract： This study imitated the IC package with different solder mask thickness in different environment of the temperature and moisture to see if the adhesion strength changed after IR-Reflow process. The temperature and moisture of the environment were...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49060319548462063382 |