Board Level Reliability of IC Package Under Cyclic Thermomechanical Loading
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 90 === Abstract The study on SOC of article is one of package way for CSP. The SOC transmits messages by Solder Ball joining the board. It can make the volume of product decrease, but the reliability reduces on using. So the reliability of Solder Ball is a very im...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43295331319420191965 |