Finite element analysis and die design in extrusion processes of heat sinks for CPU

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 90 === This paper uses a finite element code〝DEFORM 3D〞to simulate the plastic deformation behavior in extrusion processes of heat sink for CPU. The relationships between the loading, strain, velocity distribution, and formability of the extruded product as well as...

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Bibliographic Details
Main Authors: Ho-Chen Chen, 陳賀振
Other Authors: Yeong-Maw Hwang
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/62785258319372145138