Lead-Free Sn-Ag and Sn-Ag-Bi Solder Powders Fabricated by Mechanical Alloying
碩士 === 國立清華大學 === 材料科學工程學系 === 90 === In the practice of package system, solder plays a crucial role in the assembly and interconnection of silicon die. In this study, mechanical alloying (MA) process was used to produce the lead free solder pastes of Sn-3.5Ag and Sn-3.5Ag-4Bi....
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28404889731487772315 |