Elemental Diffusion Behavior in the Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints During Annealing
碩士 === 國立清華大學 === 材料科學工程學系 === 90 === Cu is widely used in today's electronics packaging, and electroless Ni-P (EN)/Cu is popularly adopted in the under bump metallurgy (UBM) for flip chip application. The diffusion behavior of Cu in the metallization layer is an important issue. In...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46771358765160335385 |