INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
碩士 === 國立清華大學 === 動力機械工程學系 === 90 ===
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/73363477406249436890 |