INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY

碩士 === 國立清華大學 === 動力機械工程學系 === 90 ===

Bibliographic Details
Main Authors:	WU, CHUN-SHENG, 吳俊生
Other Authors:	WANG, WEI-CHUNG
Format:	Others
Language:	zh-TW
Published:	2002
Online Access:	http://ndltd.ncl.edu.tw/handle/73363477406249436890

id	ndltd-TW-090NTHU0311082
record_format	oai_dc
spelling	ndltd-TW-090NTHU03110822015-10-13T10:34:06Z http://ndltd.ncl.edu.tw/handle/73363477406249436890 INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY 以雲紋干涉術探討機械加工對於電子封裝體熱行為之影響 WU, CHUN-SHENG 吳俊生碩士國立清華大學動力機械工程學系 90 WANG, WEI-CHUNG 王偉中 2002 學位論文 ; thesis 98 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 動力機械工程學系 === 90 ===
author2	WANG, WEI-CHUNG
author_facet	WANG, WEI-CHUNG WU, CHUN-SHENG 吳俊生
author	WU, CHUN-SHENG 吳俊生
spellingShingle	WU, CHUN-SHENG 吳俊生 INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
author_sort	WU, CHUN-SHENG
title	INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
title_short	INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
title_full	INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
title_fullStr	INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
title_full_unstemmed	INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
title_sort	investigation of thermal behavior of electronic packagings after machining by moire interferometry
publishDate	2002
url	http://ndltd.ncl.edu.tw/handle/73363477406249436890
work_keys_str_mv	AT wuchunsheng investigationofthermalbehaviorofelectronicpackagingsaftermachiningbymoireinterferometry AT wújùnshēng investigationofthermalbehaviorofelectronicpackagingsaftermachiningbymoireinterferometry AT wuchunsheng yǐyúnwéngànshèshùtàntǎojīxièjiāgōngduìyúdiànzifēngzhuāngtǐrèxíngwèizhīyǐngxiǎng AT wújùnshēng yǐyúnwéngànshèshùtàntǎojīxièjiāgōngduìyúdiànzifēngzhuāngtǐrèxíngwèizhīyǐngxiǎng
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INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY

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