INVESTIGATION OF THERMAL BEHAVIOR OF ELECTRONIC PACKAGINGS AFTER MACHINING BY MOIRE INTERFEROMETRY
碩士 === 國立清華大學 === 動力機械工程學系 === 90 ===
Main Authors: | WU, CHUN-SHENG, 吳俊生 |
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Other Authors: | WANG, WEI-CHUNG |
Format: | Others |
Language: | zh-TW |
Published: |
2002
|
Online Access: | http://ndltd.ncl.edu.tw/handle/73363477406249436890 |
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