The Research of Diamond Wire Slicing Brittle Materials and Process Parameters
碩士 === 國立清華大學 === 動力機械工程學系 === 90 === At present, diamond grain wire slicing is the tool that uses fixed abrasives to cut ceramic and other brittle materials. Contrast to free abrasive wire slicing, fixed abrasive wire slicing can improve material removal rate and make the diamond grain used efficie...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71442648695659777815 |