The Characterization of Flip Chip Package by Michelson Interferometry Analysis
碩士 === 國立海洋大學 === 光電科學研究所 === 90 === ABSTRACT The objective of the present research activity is to develop an effective technique using Michelson interferometer to characterize the thermal-induced deformations and stress distribution in flip chip packaging(FCP) , and the chip s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41704702183233156568 |