Simulation of warpage and reliability assessment of chip size package
碩士 === 中國文化大學 === 材料科學與製造研究所 === 90 === In this study, the reliability of low coefficient of thermal expansion (CTE) epoxy molding compound based on the flexible substrate chip scale package (CSP) was experimentally investigated. The CSP was attached on the flexible substrate as a test ve...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41790539192924393369 |