Simulation of warpage and reliability assessment of chip size package
碩士 === 中國文化大學 === 材料科學與製造研究所 === 90 === In this study, the reliability of low coefficient of thermal expansion (CTE) epoxy molding compound based on the flexible substrate chip scale package (CSP) was experimentally investigated. The CSP was attached on the flexible substrate as a test ve...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41790539192924393369 |
| Summary: | 碩士 === 中國文化大學 === 材料科學與製造研究所 === 90 === In this study, the reliability of low coefficient of thermal expansion (CTE) epoxy molding compound based on the flexible substrate chip scale package (CSP) was experimentally investigated. The CSP was attached on the flexible substrate as a test vehicle and the dimension of this test vehicle is 12mm×12mm×1.2mm. The reliability was tested by using the Joint Electron Device Engineering Council (JEDEC) JESD22A113A-level 3 method that included precondition and long tern. As the results, the test vehicle was passed the JEDEC level 3 precondition test and with a low warpage. Furthermore, the test vehicle also passed the pressure cooker test, temperature cycle test and temperature shock test under level C condition
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