Flow Field Analysis of Wet Bench Tank Coating for 200mm Wafer
碩士 === 國立臺北科技大學 === 冷凍與低溫科技研究所 === 90 === The compact rate were increased following developed of IC technology in recent years and the conductor output port（signal、source、ground）were also increased relatively. Hence the Flip-Chip Package were had become the guideline technology of multi-m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77620379695721123641 |