Research on Mechano-Chemical Planarization of Silicon Wafers
碩士 === 淡江大學 === 機械工程學系 === 90 === Brittle materials have been recognized as hard to machine and low material removal rate (MRR). Conventional approach is to apply lapping and polishing with fine abrasive machining of ductile-type or brittle type removal process. The sub-surface damage layer and resi...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45524335501556878399 |