Optical Displacement Measurement and Mechanics Analysis for Electronic Devices under Thermal Loading
碩士 === 元智大學 === 機械工程學系 === 90 === During the IR re-flow process of a PBGA component, it is frequently found that warpage results from the mismatch of coefficients of thermal expansion between the components and boards. The deformation always affects the interconnections between component and printed...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01404968754936368213 |