Measurements and Analysis of Reliability and Electrical Characteristics for Electronic Package Components
博士 === 國立中正大學 === 機械系 === 91 === As the boundaries of modern science continue to be pushed back, new materials are being developed, which facilitate the development of previously unconsidered applications. Consequently, an accurate knowledge of the material properties when adopted within micro-scale...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90603684182856934524 |