The Synthesis and CMP Application of Ceria Powder
碩士 === 逢甲大學 === 化學工程學所 === 91 === Abstract As the device feature is gradually shrinking, the quality requirement of abrasive for chemical mechanical polish (CMP) process is stricter. The CMP slurry based on cerium dioxide has higher removal rate, higher selectivity then other kinds of slurry, and...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96844941521592159325 |