Laser fracture ablation and grinding technique for ceramic materials
碩士 === 華梵大學 === 機電工程研究所 === 91 === ABSTRACT A new laser machining technique developed from the concept of fracture machining was proposed to produce a micro-removal of ceramic material. A focused laser is scanned along a constant direction to generate micro-cracks on ceramic substrate, fo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71969398331171249946 |